WL BGA Reballing Stencil Kit With Positioning Mold For iPhone X-12promax Cleaning Tool Most JC Pro1000S modules and

Most JC Pro1000S modules and V1S/V1SE boards can be used on the V1S PRO Programmer

ready to use

AC current: 2mA/200mA/20A ±(1%+3)

Huawei FIG-TL10 [Huawei Figo]

Handle cable length: ge90cm

WL BGA Reballing Stencil Kit With Positioning Mold For iPhone X-12promax Cleaning Tool Most JC Pro1000S modules andWL high accuracy BGA Reballing Stencil template for iphone 5S 6 6S 7 8 X XS MAX 11,11Pro,11 Pro Max,12,12Pro,12 Pro Max NAND and Baseband Soldering Repair, WL High Quality BGA Reballing Stencils kit come with Black Positioning Mold, WL High Quality Soldering BGA Reballing Stencil With Fixed Plate. Specifications: Material: High end Imported Steel Mesh Color: As Picture Shows Type: High Precision Ball Planting Net Model Number: WL High Quality Tin